Creep behavior evaluation and characterization of SiC film with Cr interlayer deposited by HiPIMS in Ti-6Al-4V alloy
Data
2017
Tipo
Artigo
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Resumo
This paper presents a study about creep behavior of SiC thin films with Cr interlayer deposited by High Power Impulse Magnetron Sputtering (HiPIMS) on Ti-6Al-4V alloys with Widmanstatten microstructure. After SiC/Cr film depositions, a microstructural characterization was performed using Scratching Test, Scanning Electron Microscopy (SEM), Scanning and Transmission Electron Microscopy (STEM), and Energy Dispersive Spectroscopy (EDS) techniques. Scratching tests showed that the film was well adhered to the substrate, which proves that the Cr interlayer is closely related to the strength of adhesion between SiC film and the substrate. The SiC film surface morphology has columnar shape according to STEM images. Creep test results were compared with earlier Ti-6Al-4V Widmanstatten microstructure studies, and they showed an increased lifetime for the Ti-6Al-4V Widmanstatten microstructure with SiC/Cr film, which indicates a higher creep resistance than the specimen without the SiC/Cr film. The SiC/Cr film deposited by HiPIMS improved the creep behavior of the Ti-6Al-4V Widmanstatten microstructure. (C) 2016 Elsevier B.V. All rights reserved.
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Citação
Surface & Coatings Technology. Lausanne, v. 309, p. 410-416, 2017.